Signal and Power IntegritySimplified 2/E

The #1 Practical Guide to Signal Integrity Design-Now Updated with Extensive New Coverage

This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This edition's extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design-topics at the forefront of contemporary electronics design.

Coverage includes

A fully up-to-date introduction to signal integrity and physical designHow design and technology selection can make or break the performance of the power distribution networkExploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductancePractical techniques for analyzing resistance, capacitance, inductance, and impedanceSolving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurementUnderstanding how interconnect physical design impacts signal integrityManaging differential pairs and lossesHarnessing the full power of S-parameters in high-speed serial link applicationsEnsuring power integrity throughout the entire power distribution pathRealistic design guidelines for improving signal integrity, and much moreUnlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.

• 作者： Eric Bogatin
• 出版社： 全華圖書股份有限公司 出版日期：2009-07-17 ISBN/ISSN：0132349795
• 語言：繁體中文 裝訂方式：精裝 頁數：730頁
• 類別： 中文書> 科學> 應用科學