ADVANCED ELECTRONIC PACKAGING 2/E

As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained.

An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.

"…a very nice reference." (IEEE Circuits & Devices Magazine, November/December 2006)
"...offers a broad perspective on electronic packaging." (Advanced Packaging Online, August 11, 2006)
"...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off." (Chip Scale Review, July 2006)
"…useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies." (CircuiTree, May 1, 2006)

Chapter 1: Introduction and overview of microelectronic packaging.
Chapter 2: Materials for microelectronic packaging.
Chapter 3: Processing technologies.
Chapter 4: Organic printed circuit board materials and processes.
Chapter 5: Ceramic substrates.
Chapter 6: Electrical considerations, modeling, and simulation.
Chapter 7: Thermal considerations.
Chapter 8: Mechanical design considerations.
Chapter 9: Discrete and embedded passive devices.
Chapter 10: Electronic package assembly.
Chapter 11: Design considerations.
Chapter 12: Radio frequency and microwave packaging.
Chapter 13: Power electronics packaging.
Chapter 14: Multichip and three-dimensional packaging.
Chapter 15: Packaging of MEMS and MOEMS: challenges and a case study.
Chapter 16: Reliability considerations.
Chapter 17: Cost evaluation and analysis.
Chapter 18: Analytical techniques for materials characterization.