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COOLING TECHNIQUES FOR ELECTRONIC EQUIPMENT 2/E的圖書 |
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COOLING TECHNIQUES FOR ELECTRONIC EQUIPMENT 2/E 作者:STEINBERG 出版社:JOHN WILEY & SONS 出版日期:1991-01-01 |
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Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
Evaluating the Cooling Requirements.
Designing the Electronic Chassis.
Conduction Cooling for Chassis and Circuit Boards.
Mounting and Cooling Techniques for Electronic Components.
Practical Guides for Natural Convection and Radiation Cooling.
Forced-Air Cooling for Electronics.
Thermal Stresses in Lead Wires, Solder Joints, and Plated Throughholes.
Predicting the Fatigue Life in Thermal Cycling and Vibration Environment.
Transient Cooling for Electronic Systems.
Special Applications for Tough Cooling Jobs.
Effective Cooling for Large Racks and Cabinets.
Finite Element Methods for Mathematical Modeling.
Environmental Stress Screening Techniques.
References.
Index.
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