Printed Electronics for Smart Packaging

Cutting-edge information about materials, technologies, and mechanisms of printed electronics, and their applications for the smart packaging

Printed Electronics for Smart Packaging describes how and why to use printed electronic devices for application in smart packaging.

Written by two highly qualified academics, Printed Electronics for Smart Packaging covers sample topics such as:

• Applications of printed electronics, such as flexible screens, intelligent labels and packaging, interactive books and posters, and even upholstery
• Mechanisms of smart packaging, printing methods and integrated strategies, and functional inks and substrates for smart packaging
• Printed tracks for smart tags and IPES, printed optoelectronic devices and energy suppliers for smart packaging, and printed sensors and indicators
• Integrated printed electronics systems, and expert outlooks and perspectives on potential future directions for research and development in the field

A must-have resource for anyone to expand the knowledge of the latest developments for intelligent packaging, Printed Electronics for Smart Packaging is an essential read for not just related academics but also various intersecting industries and professionals due to the importance of packaging in all market sectors.

Wei Wu is full professor and Head of Laboratory of Printable Functional Materials and Printed Electronics, Dean of School of Printing and Packaging, Wuhan University. He received the 15th Bi Shen Award of Printing Technology in 2019, STAM Best Paper Award in 2017 and Hong Kong Scholars Award in 2014. Jing Liang, PhD, Laboratory of Printable Functional Materials and Printed Electronics, School of Printing and Packaging, Wuhan University in China.