購物比價找書網找車網
FindBook
排序:
 
 有 1 項符合

cepeda-rizo

的圖書
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
$ 3719 ~ 5775
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
作者:Cepeda-Rizo 
出版社:CRC Press
出版日期:2021-12-30
語言:英文   規格:精裝 / 256頁 / 普通級/ 初版
圖書介紹2 查價格、看圖書介紹
圖書介紹 - 資料來源:博客來   評分:
圖書名稱:Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

內容簡介

Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example.

Features:

  • Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars.
  • Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded.
  • Examines innovative low-cost thermal and power systems.
  • Explains how to design to survive rocket launch, the surfaces of Mars and Venus.

Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromisingreliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.

 

作者簡介

Juan Cepeda-Rizo obtained his bachelor’s degree in mechanical engineering and master’s in materials engineering from Cal Poly, San Luis Obispo in 1997. After graduation he worked for a semiconductor company doing electronic packaging analysis. He received his Ph.D. from Claremont Graduate University in Applied Mathematics in and in 2008 worked for NASA’s Jet Propulsion Laboratory as a thermal system engineer where his latest responsibilities included thermal and structural analysis of flight electronics.

Jeremiah Gayle obtained his bachelor’s degree in mechanical engineering from Arizona State University, and master’s degrees from Iowa State, and John Hopkins University in space systems engineering. He is pursuing a doctorate in aerospace engineering from Colorado State University and works at NASA’s Jet Propulsion Laboratory where he works on spacecraft systems and conducts thermal and structural analysis of avionics.

Joshua Ravich is a supervisor for the Technology Infusion group at JPL, where he works on the mechanical design and analysis of spacecraft systems. His recent work has included the Mars Helicopter project. He received a bachelor’s degree in mechanical Engineering from UC Berkeley and a master’s in mechanical and aerospace engineering from the University of Michigan.

 

詳細資料

  • ISBN:9781032160818
  • 規格:精裝 / 256頁 / 普通級 / 初版
  • 出版地:英國
贊助商廣告
 
 
金石堂 - 暢銷排行榜
女友的朋友(4)
作者:じゅら
出版社:台灣角川股份有限公司
出版日期:2024-11-21
$ 111 
博客來 - 暢銷排行榜
兄弟上場(限量蓋章版,加贈「兄弟上場」刺繡布章)
作者:周思齊
出版社:遠流
出版日期:2024-10-30
$ 355 
博客來 - 暢銷排行榜
神奇柑仔店18:紅子與錢天堂的起點
作者:廣嶋玲子
出版社:親子天下
出版日期:2024-10-31
$ 284 
Taaze 讀冊生活 - 暢銷排行榜
懂生,才懂死
作者:佩瑪.丘卓
出版社:心靈工坊文化事業股份有限公司
出版日期:2024-06-07
$ 300 
 
Taaze 讀冊生活 - 新書排行榜
生活的藝術:52個打造美好人生的思考工具
作者:魯爾夫.杜伯里
出版社:商周出版
出版日期:2024-11-07
$ 300 
Taaze 讀冊生活 - 新書排行榜
飛越海闊天空-心航海時代四部曲
作者:眭澔平
出版社:暖暖書屋文化
出版日期:2024-10-23
$ 330 
博客來 - 新書排行榜
獲利軌道:只要沿著規畫的軌道前進,期權翻倍獲利易如反掌
作者:軌道鞅
出版社:玩股網
出版日期:2024-11-01
$ 316 
Taaze 讀冊生活 - 新書排行榜
裝酷的我被要求教她做愛...
作者:あずまゆき
出版社:暮想出版股份有限公司
出版日期:2024-11-14
$ 235 
 

©2024 FindBook.com.tw -  購物比價  找書網  找車網  服務條款  隱私權政策