Ohring

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.

Milton Ohring - Stevens Institute of Technology, Hoboken, New Jersey
with
Lucian Kasprzak, IBM Retired

CH 1 An Overview of Electronic Devices and Their Reliability
CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated
CH 3 Defects, Contamination and Yield
CH 4 The Mathematics of Failure and Reliability
CH 5 Mass Transport-Induced Failure
Ch 6 Electronic Charge-Induced Damage
CH 7 Environmental Damage to Electronic Products
CH 8 Packaging Materials, Processes, and Stresses
CH 9 Degradation of Contacts and Packages Interconnections
CH 10 Degradation and Failure of Electro-Optical Materials and Devices
CH 11 Characterization and Failure Analysis of Materials and Devices
CH 12 Future Directions and Reliability Issues