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Reliability & Failure of Electronic Materials & Devices 2/e

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Reliability & Failure of Electronic Materials & Devices 2/e
$ 1280
Reliability & Failure of Electronic Materials & Devices 2/e
作者:Ohring 
出版社:滄海書局
出版日期:2015-01-01
規格: / 760頁
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圖書名稱:Reliability & Failure of Electronic Materials & Devices 2/e
  • 圖書簡介

    Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.

  • 作者簡介

    Milton Ohring - Stevens Institute of Technology, Hoboken, New Jersey
    with
    Lucian Kasprzak, IBM Retired

     

  • 目次

    CH 1 An Overview of Electronic Devices and Their Reliability
    CH 2 Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated
    CH 3 Defects, Contamination and Yield
    CH 4 The Mathematics of Failure and Reliability
    CH 5 Mass Transport-Induced Failure
    Ch 6 Electronic Charge-Induced Damage
    CH 7 Environmental Damage to Electronic Products
    CH 8 Packaging Materials, Processes, and Stresses
    CH 9 Degradation of Contacts and Packages Interconnections
    CH 10 Degradation and Failure of Electro-Optical Materials and Devices
    CH 11 Characterization and Failure Analysis of Materials and Devices
    CH 12 Future Directions and Reliability Issues

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